Scroll to top
© 2022 DSK Technologies Pte Ltd.

BG Tape, Back Grinding Tape


Wafer Back Grinding Tape

Wafer Back Grinding Tape Designed for Semiconductor Wafer. It has outstanding characteristics support the backgrind process of wafer manufacturing. Two types of Back Grinding Tape are available: UV curable type, which achieves easier peeling after reducing adhesion by UV irradiation, and non-UV type. Back grinding tapes protect the surface of wafer circuits and prevent them from being damaged during back grinding process.

Product Features:
  • High Adhesion to wafer circuit surface and it reduces after UV irradiation
  • Prevent water penetration during wafer backgrinding process
  • Reduce wafer warpage after Backgrinding
  • Low TTV after Backgrinding
  • No Ionic Impurities

    Interested in Discussing?

    We’d love to answer any questions you may have. Send us an email or come for a visit.