Wafer Back Grinding Tape Designed for Semiconductor Wafer. It has outstanding characteristics support the backgrind process of wafer manufacturing. Two types of Back Grinding Tape are available: UV curable type, which achieves easier peeling after reducing adhesion by UV irradiation, and non-UV type. Back grinding tapes protect the surface of wafer circuits and prevent them from being damaged during back grinding process.
High Adhesion to wafer circuit surface and it reduces after UV irradiation
Prevent water penetration during wafer backgrinding process