Thermal release tape adheres tightly at normal temperature, yet can be peeled off effortlessly when necessary by heating it. It is useful for various applications in semiconductor and electronics as well as various temporary fixing. The pressure sensitive adhesive is composed of a layer of adhesive on a substrate which reduces peeling force when heated to a certain temperature. With no residue left after removal, no clean-up is needed. The tape contributes significantly to automation during various electronic component manufacturing processes. DSK Technologies customizes various thermal release tapes for your needs.
Prevent Package deformation caused by wrinkle of the film
Prevent mold flashes during epoxy molding process
Prevent package destruction by static charge (AS only)
Reduce damage due to low adhesion and easy release after molding