Scroll to top
© 2022 DSK Technologies Pte Ltd.

Copyright © 2023 DSK Technologies Pte Ltd. All Rights Reserved.
Web Design by Pixart Pte Ltd.

Wafer Dicing Tape, UV Dicing Tape

  1. Home/
  2. Our Products/
  3. Tapes/
  4. Wafer Dicing Tape

Previous product

Mold Cleaning Rubber Sheet

Next product

Wafer Back Grinding Tape
Tapes

Wafer Dicing Tape

This Dicing Tape is designed for Blade Dicing and Laser Dicing Process. Wafer Dicing tape holds the dies together during the cutting process

Product Features:
  • Prevent chip fly-off and easy release after UV irradiation
  • Expandability for die seperation
  • No residue on the die after pick up

 

 

Share project
Product Enquiry

    Interested in Discussing?

    We’d love to answer any questions you may have. Send us an email or come for a visit.