Scroll to top
© 2022 DSK Technologies Pte Ltd.

Wafer Dicing Tape, UV Dicing Tape


Wafer Dicing Tape

This Dicing Tape is designed for Blade Dicing and Laser Dicing Process. Wafer Dicing tape holds the dies together during the cutting process

Product Features:
  • Prevent chip fly-off and easy release after UV irradiation
  • Expandability for die seperation
  • No residue on the die after pick up



    Interested in Discussing?

    We’d love to answer any questions you may have. Send us an email or come for a visit.