DSK Technologies provide dicing services on wafer with various diameters on both patterned and non-patterned substrates. Quality and precision are crucial in silicon and semiconductor wafer dicing service. DSK ensures precision through each wafer dicing stage. It translates to cleaner wafers, less distortions and material loss reduction. We accommodate special request, such as assembling the diced dies into packages or leaving them on tape for future assembly activity. DSK Technologies provides global customers with customized precision of wafer dicing services. Contact us for wafer dicing support.