UV curable dicing tapes whose features can be changed in accordance with operational process. The tape’s strong adhesion secures wafers during dicing, and then is reduced by UV irradiation to facilitate pick-up. This dicing tape is essential for full-cut dicing of wafers to improve die quality, and fully applicable to dies of multiple sizes. Used with UV light exposure (with certain wave length), the adhesion is greatly reduced (irreversible reaction), the object is then easily removed/ picked up after operation
Used in chip dicing, wafer back grinding, MLCC cutting, LED dicing, lens dicing, nameplate cutting and any substrate cutting.