Through AWP2, AWP3 series(Non-UV DAF) application, semiconductor packaging companies can get a 1-step process(UV process) reducing benefit.
DAF Structure & Shape:
– DAF is consist of 4 layers including die attach film(DAF) layer.
– DAF layer has circle shape to fit for ring frame and wafer attachment.
DAF Pre-cut :
AMC guarantees below specification and actual test result shows stable performance. And Pre-cut size can be adjusted depends on customer’s request.
DAF Properties & Line-up:
AMC checks and controls other properties even though not included in specification.
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