Wafers

Wafer Dicing Flanges

It is mainly used in semiconductor wafers, functional ceramics and optical glass dicing fields. It could match with DISCO, ADT, TSK and other domestic precision dicing machines. We can produce 2 ” 3 ” 4 ” Flange match DISCO, ADT and TSK models

The product is made of titanium alloy, which has the advantages of light weight, high strength, end face runout and small dynamic balance (end jump accuracy ≤ 1um, vibration intensity ≤ 0.3mm/s). The company can design and manufacture a variety of standard and non-standard flanges according to your requirement.

Ceramic Tray

• High purity raw material control, minimal particle size distribution
• High accuracy（ φ 400mm, flatness ≤ 1.0 μ m； 400mm≤ φ ≤ 700mm, flatness ≤ 2.0 μ m）
• High hardness and good durability—The hardness reaches above grade Y
• Equipment models that can be matched
• Nachi—SPM-9/SPM-23   SpeedFam —50/59SPAW
• NTS— NSD-4036/4050 NSC-4028/4036/4050