BG Tape, Back Grinding Tape
Wafer Back Grinding Tape Designed for Semiconductor Wafer. It has outstanding characteristics support the backgrind process of wafer manufacturing. Twotypes of Back Grinding Tape are available: UV curable type, which achieves easier peeling after reducing adhesion by UV irradiation, and non-UV type.
Back grinding tapes protect the surface of wafer circuits and prevent them from being damaged during back grinding process
- Prevent water penetration during wafer backgrinding process
- Reduce wafer warpage after Backgrinding
- Low TTV after Backgrinding
- No Ionic Impurities
Interested in discussing?
We’d love to answer any questions you may have. Send us an email or come for a visit.