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Thermal Release Tape

Thermal release tape adheres tightly at normal temperature, yet can be peeled off effortlessly when necessary by heating it. It is useful for various applications in semiconductor and electronics as well as various temporary fixing. The pressure sensitive adhesive is composed of a layer of adhesive on a substrate which reduces peeling force when heated to a certain temperature. With no residue left after removal, no clean-up is needed. The tape contributes significantly to automation during various electronic component manufacturing processes. DSK Technologies customizes various thermal release tapes for your needs.







Product Features:

Good adhesion force at the lamination
Light blue colour and semi-transparent are availaible
Good for Back Grinding, Dicing and Molding process
Easy to peel off after heating.


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