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Lead Frame Backside Tape

Lead Frame Backside tape is used in molding process for QFN package

Lead frame backside tape is a supoorting tape used in map molding process of QFN. attaching on the reserve side of the lead frame, it has achieved no flash burr after molding.

Product Features:

No mold flashes and bleeding after molding.
No residue remained on lead frame after peeling

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