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OUR PRODUCTS > Tapes > Wafer Dicing tape

Wafer Dicing Tape, UV Dicing Tape

This Dicing Tape is designed for Blade Dicing and Laser Dicing Process



Wafer Dicing tape holds the dies together during the cutting process

Product Features:

Prevent chip fly-off and easy release after UV irradiation

Expandability for die seperation

No residue on the die after pick up



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