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Wafer Back Grinding Tape

Wafer Back Grinding Tape Designed for Semiconductor Wafer



Back grinding tapes protect the surface of wafer circuits and prevent them from being damaged during back grinding process
 

Product Features:
 
- High Adhesion to wafer circuit surface and it reduces after UV irradiation

- Prevent water penetration during wafer backgrinding process

- Reduce wafer warpage after Backgrinding

- Low TTV after Backgrinding 

- No Ionic Impurities 


 
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