Etched Lead Frame
Fine Pitch 0.140mm (Mass Production)
Advanced Packaging Reliability Treatment (Roughness-Cu)
Main Packages: QFN, QFP, TSOP, SOIC, PLCC, SOT
- Good Unifomity of Half Etching in QFN
- Precise Ag plating tolerance in QFN
- Deep & Precise Downset in TQFP
- Good surface morphology (Rough-Cu) in RBO, CPO, Delamination
- 100% auto final inspection for whole type (Area, line scan)
Interested in discussing?
We’d love to answer any questions you may have. Send us an email or come for a visit.