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Lead Frame

Etched Lead Frame


Fine Pitch 0.140mm (Mass Production)

Advanced Packaging Reliability Treatment (Roughness-Cu)

Main Packages: QFN, QFP, TSOP, SOIC, PLCC, SOT


 

Product Features:

- Good Unifomity of Half Etching in QFN
- Precise Ag plating tolerance in QFN
- Deep & Precise Downset in TQFP
- Good surface morphology (Rough-Cu) in RBO, CPO, Delamination
- 100% auto final inspection for whole type (Area, line scan)

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