Scroll to top
© 2022 DSK Technologies Pte Ltd.

Dicing Blades

Dicing Blades

Dicing Blades

We consistently produce high quality saw blades for cutting QFN, MLF, MLPD, VQFN, PPF, DFN, BGA, ceramics such as alumina oxide, alumina nitride, LTCC, HTCC; crystals such as sapphire, lithium niobate, lithium tantalate; other hard and brittle materials such as glass, fused silica, quartz, silicon wafers, garnet, copper, mold compound, and epoxy.

    Interested in Discussing?

    We’d love to answer any questions you may have. Send us an email or come for a visit.